Tom's Hardware (1 hour ago)
Micron rejects 4F2, intends to use wafer bonding and High-NA EUV before going 3D NAND over the next few years.
Read the full story on Tom's Hardware.
Asus adds an OLED screen, TMR sticks, and more comfortable grips to its AMD-powered gaming handheld.
SPONSORED FEATURE: The Register’s Washington dinner with HPE and NVIDIA is this Thursday. The table is nearly set.
Ars spends the weekend with the Audi Revolut F1 team at the Circuit of the Americas.
A Chinese team has claimed a new world record for real-time transfer speeds across a 24-core optical fiber cable.
A benchmark leak and a direct clock-matched comparison from an enthusiast seed the idea that Zen 6 may come with a decent IPC bump as well as increased clocks.
Glasses-free 3D gaming is now more affordable
Professional Windows crusher NTDEV has showcased their next-generation tool for compressing Windows 11 with a video of an install that fits on a single CD-ROM.
Cadence unveiled Maestro, domain-specialized AI models for its chip design agents, with early access for select customers in Q4 2026.
Chinese vessels are spending more time near undersea cables in the Pacific than nearly 50 other nations, according to a new report by the Center for Strategic and International Studies.
Intel CEO Lip-Bu Tan has reportedly discussed potential areas of cooperation with AMD chief Lisa Su as Intel works to rebuild its CPU business and expand its foundry operations.
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